This study investigated the enhanced cooling of electronic components at high temperatures with cross-flow and jet-flow combinations. The cooling performance of four different model geometries (Models 1, 2, 3, and 4) of an electronic component was analysed by considering different jet-to-channel inlet velocity ratios (Vj/Vc) and ratios of the distance between the jet and impinging surface to jet diameter (H/D). The Vj/Vc and H/D ratios were varied in the 0–3 and 2–4 ranges, respectively, in the computational fluid dynamics analysis. The thermal and flow characteristics were revealed through a comparative result analysis, also considering results from the literature. The heat transfer improved, the Nusselt number increased, and the electronic surface temperature decreased with an increase in the Vj/Vc ratio. However, the Nusselt number decreased with an increase in the H/D ratio. Models 2 and 4 had higher heat transfer from the electronic component than the other models. A low H/D ratio and low Vj/Vc ratio yielded higher heat transfer in Model 3 than in Model 1.